Multiplexing für Verbindungsreparatur

Details

Veröffentlichungs-Nr.

EP4632746

Aktenzeichen

EP24170121

Anmeldetag

12. April 2024

Veröffentlichung

15. Oktober 2025

Rechtsraum

EP

IPC

G11C29/00// G11C29/02H01L23/538

Abstract

An integrated circuit (1) comprising: a plurality of interconnects (2) forming at least four repair chains (A, B, C, D), each repair chain (A, B, C, D) comprising: a plurality of primary interconnects (21) for providing a signal path (3), a spare interconnect (22), and circuitry (4) configured for offsetting, within each repair chain, signal paths (3) so as to avoid the use of a defective primary interconnect (23), when present, within the repair chain (A, B, C, D), wherein one signal path (3) is offset to the spare interconnect (22), wherein the plurality of interconnects (2) is arranged so that spatially neighbouring interconnects (2) belong to different repair chains (A, B, C, D).

Anmelder

Firma

IMEC VZW

Land

🇧🇪 Belgien

Fachgebiete