Hochdichte Gestapelte Transistoren mit Unabhängigen Gates
Anmelder: Intel Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4651673
- Aktenzeichen
- EP25168904
- Anmeldetag
- 7. April 2025
- Veröffentlichung
- 19. November 2025
- Rechtsraum
- EP
- IPC
- H10D84/01H10D30/01H10D30/00H10D84/03H10D88/00
Abstract
A vertical stack of three-dimensional transistors, such as nanoribbon-based transistors, includes a stack of nanoribbons with independent gates around subsets of nanoribbons in the stack. In previous nanoribbon transistors, a gate electrode wraps around all of the semiconductor regions and spans the areas between adjacent semiconductor regions, thus electrically coupling the centers of the semiconductor regions. To achieve a stack of semiconductor regions with independent gates, adjacent nanoribbons in the stack may be set at different distances apart, or two or more sacrificial materials may be included when forming the stack of semiconductor materials and selectively etched when forming different gates.
Anmelder
- Firma
- Intel Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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