Vorrichtungen mit Substratstruktur mit Seitlich Versetzten Massedurchgängen und Metallkugeln

Details

Veröffentlichungs-Nr.

EP4712705

Anmeldetag

5. September 2025

Veröffentlichung

18. März 2026

Rechtsraum

EP

Abstract

Devices including a substrate structure with laterally offset ground vias and metal balls are provided. A device may include a substrate, a plurality of first ground vias, and a plurality of first metal balls. The plurality of first ground vias may be formed within the substrate and surrounding a plurality of signal vias. The plurality of first metal balls may be disposed on the substrate and electrically coupled to the plurality of first ground vias. One first metal ball may be electrically coupled to one first ground via. A part of the plurality of first ground vias may be laterally offset from a corresponding part of the plurality of first metal balls along a direction orthogonal to the substrate.

Anmelder

Firma

MEDIATEK INC.

Land

🇹🇼 Taiwan