Geformte Verpackungen mit Daran Befestigten Verbindungsstücken

Details

Veröffentlichungs-Nr.

EP4712757

Anmeldetag

29. August 2025

Veröffentlichung

18. März 2026

Rechtsraum

EP

Abstract

An electronic device has a molded package (e.g., a quad flat no leads package) with attached connectors. The molded package includes one or more semiconductor dies and is pretested prior to attachment of the connectors. Along these lines, such molded packages may be pretested in parallel at high volume due to their relatively small form factor (e.g., at numbers several times greater than those for testing leaded socket assemblies). Following such pretesting, the connectors are attached to the pretested molded package (e.g., by directly fusing the connectors to metallic pads on surfaces of the packaged integrated circuit via laser welding or soldering). Such electronic devices may be further tested if desired (e.g., opens/shorts tested) and encased within housings to form larger modules (e.g., accelerometers, pressure sensors, etc.).

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA