Chipvorrichtung zur Herstellung einer Sekundärbatterie und Verbindungsknockout-Einheit für die Chipvorrichtung

Details

Veröffentlichungs-Nr.

EP4714568

Anmeldetag

28. Juli 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

Abstract

The present disclosure relates to a die apparatus for manufacturing a secondary battery and a link-type knockout unit for the die apparatus. The die apparatus for manufacturing a secondary battery includes a lower die that supports an electrode plate and has one or more scrap discharge holes, an upper die positioned above the lower die and including a punch corresponding to each of the scrap discharge holes, and a knockout unit including a pad vertically moving inside the scrap discharge hole and a pad support that supports the pad upward and allows the pad to apply a reaction force corresponding to a downward pressure of the punch to a bottom surface of the electrode plate when the punch moves downward.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea