Beschichtungsbandzuführsystem für ein Elektrodenplattensubstrat

Details

Veröffentlichungs-Nr.

EP4714880

Anmeldetag

11. Juni 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

Abstract

A lamination tape feeding system for an electrode plate substrate is provided. The lamination tape feeding system includes an input roll configured to input a lamination tape to be attached to an uncoated region of the electrode plate substrate to which an active material is applied, a plurality of guide rolls configured to guide the lamination tape, a discharge roll configured to discharge the lamination tape. The system also includes at least one crown roll that is disposed in a path of the lamination tape between the input roll and the discharge roll, disposed in the path between the guide rolls, and has a maximum height at the center of a width direction that intersects the moving direction of the lamination tape, with the height decreasing toward ends the at least one crown roll.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea