Packung mit einer unter Druck Stehenden Flüssigkeit in einer Testdose

Details

Veröffentlichungs-Nr.

EP4715394

Anmeldetag

9. Juli 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

IPC

G01R1/04, G01R31/28

Abstract

According to various aspects of the present disclosure, a semiconductor testing equipment may include a thermal head assembly having a body with a recess that is unobstructed and designed to fit over a die on the semiconductor package. A sealing member on the thermal head assembly engages a landing area on the semiconductor package to form a sealed chamber. The semiconductor package may be uniformly loaded by introducing a gas and incrementally increasing the gas pressure in the sealed chamber and increasing mechanical load on the sealing member onto the landing area to prevent leakage. Once the sealed chamber is fully sealed, the combined internal pressure from the circulating gas and a sealing perimeter load enables the proper socketing of the semiconductor package. Thereafter, the gas may be replaced with a circulating liquid refrigerant to remove the heat generated by the die during the testing of the semiconductor package.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA