Selbst-Expandierbare Verbindungsstrukturen für Oberflächenmontierte Halbleiteranordnungen

Details

Veröffentlichungs-Nr.

EP4715871

Anmeldetag

23. September 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

Abstract

In an embodiment, a semiconductor device includes a wiring substrate. A chip, such as microchip, integrated circuit device, a semiconductor die, or the like is on a first surface of the wiring substrate. A plurality of protruding portions are on a second surface of the wiring substrate. Each protruding portion includes a solder reservoir space therein that can contain or be filled with solder so as to permit solder from the reservoir space to flow outward in a solder reflow process for bonding the semiconductor device to a circuit board or the like. The solder from the reservoir is available to compensate for differences in gap distances between the semiconductor device and a circuit board or the like that arise in the manufacturing of electronic devices when attempting to bond a semiconductor device to a circuit board. The protruding portions may comprise tubes, posts, pairs of plates, or the like.

Anmelder

Firma

Avago Technologies International Sales Pte. Limited

Land

🇸🇬 Singapur