Laminierte Struktur, Quantenvorrichtung und Verfahren zur Herstellung einer Laminierten Struktur

Details

Veröffentlichungs-Nr.

EP4716440

Anmeldetag

16. Mai 2023

Veröffentlichung

21. November 2024

Rechtsraum

EP

Abstract

A laminated structure includes a cooling member; a circuit board provided on the cooling member and formed with a through hole; a device provided on the circuit board and including a quantum bit; and a bonding material configured to bond the circuit board and the device to each other, wherein the bonding material includes a first bonding portion in contact with a portion of an upper surface of the cooling member exposed from the through hole, an upper surface of the circuit board, and a lower surface of the device; and a second bonding portion provided around the first bonding portion in plan view and in contact with at least the upper surface of the circuit board and the lower surface of the device, and wherein a thermal conductivity of the first bonding portion is higher than a thermal conductivity of the second bonding portion, and an elastic modulus of the second bonding portion is lower than an elastic modulus of the first bonding portion. The laminated structure can be used for quantum computing, for example.

Anmelder

Firma

FUJITSU LIMITED

Land

🇯🇵 Japan