Substratverarbeitungsvorrichtung und Steuerungsverfahren

Details

Veröffentlichungs-Nr.

EP4716445

Anmeldetag

15. September 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

IPC

H10P72/00(AIHARA TOMOAKI et al.)

Abstract

A substrate processing apparatus includes: plurality of diverging pipes (PW) formed by branching of a merging pipe downstream of a pump (15) and configured to deliver processing liquid to a plurality of types of processing units in a chamber (41); and a control unit (139) configured to control the pump (15). The plurality of diverging pipes (PW) include a pre-wet pipe (PW) having a largest flow rate of processing liquid and a pot-rinse pipe (PTR) having a flow rate of processing liquid smaller than the flow rate of the pre-wet pipe (PW), a pressure sensor configured to detect a pressure of processing liquid is provided in the pre-wet pipe (PW) among the plurality of diverging pipes (PW), and the control unit (139) controls an output of a pump (15) to allow the pressure sensor (51) to detect a predetermined value.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan