Halbleiterpackung
Anmelder: Nexperia B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4716452
- Anmeldetag
- 20. September 2025
- Veröffentlichung
- 25. März 2026
- Rechtsraum
- EP
Abstract
An encapsulated semiconductor package is proposed at least comprising a lead frame made from an electrically conductive metal material as well as at least two terminals; at least one semiconductor die structure having a first die side and a second die side opposite to the first die side and mounted with its second die side on the lead frame; a plurality of connections electrically and mechanically connecting the at least one semiconductor die structure with the at least two terminals of the lead frame; at least one heat sink pad mounted to the first die side of the semiconductor die structure; and a moulding resin encapsulating the lead frame, the at least one semiconductor die structure, the plurality of connections, the at least one heat sink pad and the at least two terminals leaving at least a portion of the heat sink pad and at least a portion of the at least two terminals exposed, and forming the semiconductor package having a heat sink pad package surface side and a lead frame package surface side, wherein the moulding resin at the heat sink pad package surface side and/or the lead frame package surface side is provided with at least one resin spacer element extending from the respective package surface side.
Anmelder
- Firma
- Nexperia B.V.
- Land
- 🇳🇱 Niederlande
Der Anmelder ist ein niederländischer Halbleiterhersteller mit Sitz in Nijmegen, der als Ausgründung aus NXP Semiconductors hervorging. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Elektronik, Schaltungstechnik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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