Mems-Druckwandlergehäuse auf Waferebene in Chipgrösse und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4717664

Anmeldetag

27. September 2024

Veröffentlichung

1. April 2026

Rechtsraum

EP

IPC

B81C1/00, H04R19/00

Abstract

The present disclosure concerns a MEMS pressure transducer Wafer-Level Chip-Scale Package (100) and a method for manufacturing the same. The method comprises a step of providing a MEMS wafer (110) comprising a plurality of adjacently arranged MEMS membrane structures (120). The method comprises a further step of providing an ASIC wafer (210) comprising a plurality of adjacently arranged integrated electronic components (220), and bonding the MEMS wafer (110) with the ASIC wafer (210) with their respective front sides (111, 211) facing each other. The method comprises a further step of structuring at least one first cavity (150) into MEMS wafer (110) and structuring a smaller second cavity (160) into the first cavity (150).

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland