Verfahren und Vorrichtung zur Verbesserung der Inspektionstechniken für Integrierte Schaltungen mit Rückseitiger Stromversorgung

Details

Veröffentlichungs-Nr.

EP4718066

Anmeldetag

2. September 2025

Veröffentlichung

1. April 2026

Rechtsraum

EP

Abstract

Systems, apparatus, articles of manufacture, and methods are disclosed to improve inspection techniques for integrated circuits with backside power delivery. An example disclosed apparatus includes at least one programmable circuit to at least one of instantiate or execute the machine readable instructions to modulate first and second bitlines for a bitcell in a memory array of an integrated circuit between first and second voltages at a frequency for a period of time, the modulating of the first and second bitlines to produce a periodic heat signal in the integrated circuit, cause a thermal imaging sensor to capture a series of images of the integrated circuit during the period of time, and determine a location of a defect in the integrated circuit based on the series of images.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA