Hochdichte Elektrische und Optische Direktbondverbindung

Details

Veröffentlichungs-Nr.

EP4718131

Anmeldetag

23. September 2025

Veröffentlichung

1. April 2026

Rechtsraum

EP

IPC

G02B6/12, G02B6/43

Abstract

This disclosure describes a system for providing a high density three-dimensional electrical and optical direct bond interconnect. The system comprises an electro-optical interposer substrate and a waveguide operably coupled to the substrate. The waveguide comprises an electrical redistribution path that electrically couples at least one application-specific integrated circuit to a photonic integrated circuit, and an optical redistribution path that optically couples the circuits. The configuration enables micron-scale high density routing with both internal and external optical communication channels, allowing scalable integration of multiple electrical and optical devices.

Anmelder

Firma

II-VI Delaware, Inc.

Land

🇺🇸 USA