Substratvorrichtung
Anmelder: ASML Netherlands B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4718159
- Anmeldetag
- 30. September 2024
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
- IPC
- G03F9/00, H01L21/683, G03F7/00
Abstract
A substrate device for being held by an electrostatic clamp, the substrate device having a bottom side configured to face a substrate support surface of the clamp in use, the substrate device comprising a plasma generating part configured to form a plasma space between a first portion of the bottom side and an associated first portion of the substrate support surface of the clamp, wherein the plasma generating part is configured to generate a plasma within the plasma space, and a connection part electrically connected to the plasma generating part and configured to provide an electrically conductive connection between one or more substrate conductors provided on a second portion of the bottom side and one or more clamp conductors on the clamp during use.
Anmelder
- Firma
- ASML Netherlands B.V.
- Land
- 🇳🇱 Niederlande
Niederländisches Unternehmen, das Lithografiesysteme und weitere Anlagen für die Halbleiterfertigung entwickelt und herstellt, zentral für die Chipindustrie.
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ASML Netherlands B.V.