Intelligentes Ic-Substrat, Intelligentes Ic-Modul und Ic-Karte damit

Details

Veröffentlichungs-Nr.

EP4718316

Anmeldetag

23. Mai 2024

Veröffentlichung

28. November 2024

Rechtsraum

EP

IPC

G06K19/077, H05K1/18

Abstract

A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite the first surface, and having first and second holes passing through the first surface and the second surface and spaced apart from each other in a horizontal direction; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; a first plating layer disposed on one surface of the metal layer; a second plating layer and a third plating layer disposed on another surface of the metal layer, wherein the second plating layer overlaps the first hole, the third plating layer overlaps the second hole, and the third plating layer has a thickness greater than that of the second plating layer.

Anmelder

Firma

LG INNOTEK CO. LTD

Land

🇰🇷 Südkorea