Einpressstift und Verfahren zur Montage eines Einpressstiftes
Anmelder: Nexperia B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4718633
- Anmeldetag
- 26. September 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
- IPC
- H01R12/73, H01R13/24(ENDO TAKAYOSHI et al.)(OGAWA SHINGO et al.)(SONG HWA YOON et al.)
Abstract
According to a first example of the disclosure, a press fit pin is proposed. A press fit pin comprising a sheet spring, a roll spring, a metal pillar, a base, wherein the base comprises a bottom part and a cylinder part, wherein the cylinder part on one side is connected to the bottom part and on the other side comprises a closing means, wherein the bottom part, the cylinder part and a flange are forming a blind hole, wherein the metal pillar comprises a top metal pillar part, a bottom metal pillar part, a first rim located at the outer end of the top metal pillar part, and a second rim located between the top metal pillar part and the bottom metal pillar part, and wherein the bottom metal pillar part is connected to the first rim with a connecting portion having smaller diameter than the bottom metal pillar part, wherein the sheet spring is surrounding the top metal pillar part and is placed between the first rim and the second rim, wherein the roll spring that serves as a stress buffer rests on the bottom part of the base and on the outer end of the bottom metal pillar part, wherein the bottom metal pillar part is inserted into the base such that the flange is surrounding the connecting portion in a movable manner and wherein a diameter of the blind hole in a section defined by the flange is smaller than a diameter of the bottom metal pillar part and the second rim.
Anmelder
- Firma
- Nexperia B.V.
- Land
- 🇳🇱 Niederlande
Der Anmelder ist ein niederländischer Halbleiterhersteller mit Sitz in Nijmegen, der als Ausgründung aus NXP Semiconductors hervorging. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Elektronik, Schaltungstechnik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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