Gestapelter Ferroelektrischer Random-Access-Speicher
Anmelder: INTEL Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4718970
- Anmeldetag
- 31. Juli 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
Abstract
An integrated circuit die includes an array of memory cells between a first surface and a second surface opposite the first surface. A first memory cell proximate the first surface comprises a first capacitor over a first transistor. A second memory cell under the first memory cell comprises a second capacitor under a second transistor. The first transistor may be stacked on the second transistor. The capacitors may include ferroelectric or antiferroelectric materials. The first capacitor is coupled with a first plate line located between the first surface and the array of memory cells. A via couples the second capacitor with a second plate line between the first surface and the array of memory cells.
Anmelder
- Firma
- INTEL Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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