Gabelscheibentransistoren mit Umhülltem Gate-Dielektrikum
Anmelder: INTEL Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4718985
- Anmeldetag
- 17. September 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
Abstract
Techniques are provided to form semiconductor devices that include forksheet transistors with a self-aligned dielectric spine and nanosheets with a wrapped-around gate dielectric. The dielectric spine may be formed prior to the formation of gate structures. In an example, first and second semiconductor devices have first and second semiconductor regions, respectively, extending in a first direction. The first and second semiconductor regions may include any number of nanosheets. A dielectric spine extends in the first direction centrally aligned between the first and second semiconductor regions. The gate dielectric of the gate structures on either side of the dielectric spine is wrapped around the semiconductor regions, such that the gate dielectric is present between the nanosheets and the dielectric spine along the second direction. The dielectric spine may include a dielectric liner that itself is removed prior to formation of the gate structures, thus provided space for the wrapped-around gate dielectric.
Anmelder
- Firma
- INTEL Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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