Herstellung von Integrierten Gate-All-Around-Schaltungsstrukturen mit Skalierung Strukturierter Nanodrähte
Anmelder: INTEL Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4718995
- Anmeldetag
- 17. September 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
Abstract
Integrated circuit structures having patterned nanowire thickness scaling are described. For example, a structure includes a first device of a device type including a first vertical arrangement of horizontal nanowires, and a first gate stack having a first conductive layer over a first gate dielectric layer. A second device of the device type includes a second vertical arrangement of horizontal nanowires laterally spaced apart from the first vertical arrangement of horizontal nanowires, and a second gate stack having a second conductive layer over a second gate dielectric layer. Each of the nanowires of the second vertical arrangement of nanowires has a vertical thickness less than a vertical thickness of each of the nanowires of the first vertical arrangement of horizontal nanowires. The nanowires of the second vertical arrangement of nanowires have a vertical spacing greater than a vertical spacing of the nanowires of the first vertical arrangement of horizontal nanowires.
Anmelder
- Firma
- INTEL Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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