Vorrichtung und Verfahren zum Strecken einer Waferfolie
Anmelder: Nexperia B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4719025
- Anmeldetag
- 26. September 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
- IPC
- H10P72/00
Abstract
A device is proposed for stretching a wafer foil that is held by a film frame carrier and on which a plurality of electronic components is arranged. In particular, the device comprises a holding member for holding the film frame carrier; a tensioning member structured to engage with the wafer foil. Additionally, it comprises a drive that is structured to move at least the tensioning member from a first operational position, at which an intermediate distance between adjacent electronic components is minimal, towards a second operational position, at which the intermediate distance between adjacent electronic components is maximal, wherein a foil engaging part of the tensioning member engaging with the wafer foil is configured to move from the first operational position towards the second operational position in a direction perpendicular as well as in a direction parallel to a plane defined the wafer foil.
Anmelder
- Firma
- Nexperia B.V.
- Land
- 🇳🇱 Niederlande
Der Anmelder ist ein niederländischer Halbleiterhersteller mit Sitz in Nijmegen, der als Ausgründung aus NXP Semiconductors hervorging. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Elektronik, Schaltungstechnik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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