Schneidwerkzeug
Anmelder: Sumitomo Electric Industries, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4721899
- Anmeldetag
- 29. Mai 2024
- Veröffentlichung
- 4. Dezember 2025
- Rechtsraum
- EP
- IPC
- B23B27/14, B23C5/16, C23C16/36
Abstract
A cutting tool, comprising a substrate and a coating disposed on the substrate, wherein the coating comprises a first layer, the first layer consists of multiple hard particles, the hard particles consist of titanium, silicon, carbon, and nitrogen, the hard particles have a cubic crystal structure, the first layer has a columnar structure, in the first layer, the average of the ratio of the number of silicon atoms N<Si> to the sum of the number of titanium atoms N<Ti> and the number of silicon atoms N<Si>, N<Si>/(N<Ti> + N<Si>), is 0.01 or more and 0.10 or less, in the first layer, the average of the ratio of the number of carbon atoms Nc to the sum of the number of carbon atoms Nc and the number of nitrogen atoms N<N>, Nc/(Nc + N<N>), is 0.60 or more and 0.85 or less, the hard particles have a stacked structure in which first unit layers and second unit layers are stacked alternately, the first unit layers and the second unit layers each consist of titanium, silicon, carbon, and nitrogen, the ratio of the number of silicon atoms to the sum of the number of titanium atoms and the number of silicon atoms in the first unit layers, x1, is higher than the ratio of the number of silicon atoms to the sum of the number of titanium atoms and the number of silicon atoms in the second unit layers, x2, and the ratio of the number of carbon atoms to the sum of the number of carbon atoms and the number of nitrogen atoms in the first unit layers, y1, is higher than the ratio of the number of carbon atoms to the sum of the number of carbon atoms and the number of nitrogen atoms in the second unit layers, y2.
Anmelder
- Firma
- Sumitomo Electric Industries, Ltd.
- Land
- 🇯🇵 Japan
Japanischer Technologiekonzern mit Sitz in Osaka, Teil der Sumitomo-Gruppe. Aktiv in Kabel- und Glasfasertechnologie, Halbleitern, Automobilkomponenten sowie Elektronik- und Werkstofftechnik.
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