Verfahren zur Herstellung einer Hoch Leitfähigen Zusammensetzung nach Trocknung und Verbrennung

Details

Veröffentlichungs-Nr.

EP4722293

Anmeldetag

24. Juli 2024

Veröffentlichung

30. Januar 2025

Rechtsraum

EP

Abstract

A conductive composition contains: (A) 1.005 mass% to 1.74 mass% of a bisphenol type epoxy resin; (B) 0.015 mass% or more and less than 0.08 mass% of a (meth)acrylic resin having a weight average molecular weight of 1,000 or more and 400,000 or less; (C) 0.5 mass% to 0.86 mass% of polymer particles containing a polybutadiene rubber; (D) 5 mass% to 95 mass% of copper particles having an average particle diameter of 2 nm to 500 nm; (E) 0.9 mass% to 4.8 mass% of silver particles having an average particle diameter of 2 nm to 500 nm; (F) 0.001 mass% to 20 mass% of a phosphorus-containing compound; (G) 0.0001 mass% to 10 mass% of CuH; and (H) 0.1 mass% to 90 mass% of a solvent.

Anmelder

Firmen

Tatsuta Electric Wire & Cable Co., Ltd.
Copprint Technologies Ltd

Land

🇯🇵 Japan