Verfahren zur Messung der Flachheit eines Substratträgers einer Lithographievorrichtung
Anmelder: ASML Netherlands B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4722809
- Anmeldetag
- 17. Februar 2026
- Veröffentlichung
- 8. April 2026
- Rechtsraum
- EP
- IPC
- G03F7/00, G03F9/00(KLA TENCOR CORP et al.)
Abstract
Disclosed is a method of measuring a topography of a substrate support. The method comprises obtaining metrology data describing a topography of a substrate when clamped to the substrate support; obtaining top surface topography data and bottom surface topography data; applying a first transfer function to the bottom surface topography data to obtain processed bottom surface topography data, the first transfer function removing and/or damping topography from the bottom surface which does not transfer to the top surface when the substrate is clamped; determining corrected metrology data, corrected for a contribution of the metrology data attributable to the substrate, from a combination of the top surface topography data and the processed bottom surface topography data; and determining the topography of the substrate support from the corrected metrology data.
Anmelder
- Firma
- ASML Netherlands B.V.
- Land
- 🇳🇱 Niederlande
Niederländisches Unternehmen, das Lithografiesysteme und weitere Anlagen für die Halbleiterfertigung entwickelt und herstellt, zentral für die Chipindustrie.
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ASML Netherlands B.V
ASML Netherlands B.V · Veldhoven