Laserbearbeitungsverfahren und Waferherstellungsverfahren

Details

Veröffentlichungs-Nr.

EP4723163

Anmeldetag

9. Mai 2024

Veröffentlichung

5. Dezember 2024

Rechtsraum

EP

Abstract

By performing a laser scan, which includes moving an irradiation position (PR) of a laser beam (B) along a first direction (Ds) while irradiating a surface (21) of a machining target (2) with the laser beam, for a plurality of times with changes in position within the surface in a second direction (Df), a plurality of irradiation trajectory lines (Ls) are formed along the second direction, the second direction being orthogonal to the first direction and defined along the surface, the irradiation trajectory lines being made of irradiation marks of the laser beam and linear along the first direction. In the single laser scan, the irradiation marks are formed at a plurality of the respective irradiation positions by intermittently irradiating with the laser beam with a relative movement of the laser beam relative to the machining target along the first direction, and the irradiation marks formed by the irradiation with the laser beam that precedes are irradiated with the laser beam that follows.

Anmelder

Firma

DENSO CORPORATION

Land

🇯🇵 Japan