Verfahren zur Herstellung einer Verbindungsstruktur, Verfahren zur Herstellung eines Laminats und Verbindungsverfahren

Details

Veröffentlichungs-Nr.

EP4723164

Anmeldetag

31. Mai 2024

Veröffentlichung

5. Dezember 2024

Rechtsraum

EP

Abstract

A paste containing copper particles and an organic solvent is applied to a first member 11 to form a coating layer 13a; the organic solvent is partially removed from the coating layer 13a; pressing a second member 12 into the coating layer 13a to partially embed the second member 12 in the coating layer 13a to form a stack having the first member 11, the coating layer 13a, and the second member 12 in that order, and heating the stack 14. A press-in ratio P, defined as 100 - (Y/X × 100), is 1.0 to 50, wherein X is an average thickness of the coating layer 13a in a state after the drying step and before pressing the second member 12 into the coating layer 13a; and Y represents an average distance from the upper surface 11b of the first member 11 to the lower surface 12b of the second member 12 in the state after forming the stack 14.

Anmelder

Firma

Mitsui Kinzoku Company, Limited

Land

🇯🇵 Japan