System und Verfahren für einen Verschachtelten Kondensator
Anmelder: SAMSUNG ELECTRONICS CO., LTD. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4723823
- Anmeldetag
- 23. September 2025
- Veröffentlichung
- 8. April 2026
- Rechtsraum
- EP
- IPC
- H10B12/00, H10D1/68
Abstract
Disclosed herein are methods, devices and systems including a first capacitor with a first electrode with a first segment and a second segment extending from a proximal end to a distal end in a first direction and joined at the proximal end by a connecting segment to form a mouth. A second electrode may have a third segment, a fourth segment, and a fifth segment, which form a fork facing the first electrode in the first direction. The fork may have a first slot enclosing the first segment between the third and fourth segments, and a second slot enclosing the second segment between the fourth and fifth segments. A first semiconductor channel may be on a side of the first electrode opposite the second electrode, with the first semiconductor having a first nub end extending in the first direction into the mouth at the proximal end. An intermediate dielectric layer may be between the first electrode and the second electrode, extending alongside the third, fourth, and fifth segment in the first and the second slot.
Anmelder
- Firma
- SAMSUNG ELECTRONICS CO., LTD.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Elektronikkonzern und Teil der Samsung-Gruppe. Entwickelt und produziert Halbleiter, Speicherchips, Displays, Smartphones, Unterhaltungselektronik sowie Haushaltsgeräte für den globalen Markt.
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