Elektronische Vorrichtung und Verfahren zur Herstellung einer Elektronischen Vorrichtung
Anmelder: FUJITSU LIMITED 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4727323
- Anmeldetag
- 8. Juni 2023
- Veröffentlichung
- 12. Dezember 2024
- Rechtsraum
- EP
- IPC
- H10N60/12, H10N60/01
Abstract
An electronic device includes a substrate having a recessed portion on a first surface; a first superconducting wiring having a portion in contact with the first surface; a second superconducting wiring intersecting the first superconducting wiring in a plan view above the recessed portion and having a portion in contact with the first surface; an insulating film provided between the first superconducting wiring and the second superconducting wiring; and a first support member provided in the recessed portion and supporting at least one of the first superconducting wiring or the second superconducting wiring, wherein a hollow portion is formed between a region where the first superconducting wiring and the second superconducting wiring intersect in a plan view and a bottom surface of the recessed portion.
Anmelder
- Firma
- FUJITSU LIMITED
- Land
- 🇯🇵 Japan
Japanisches Unternehmen für Informationstechnik, das Computer, Server, Netzwerktechnik sowie IT-Dienstleistungen und Softwarelösungen entwickelt und anbietet.
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Vertreten von
-
Haseltine Lake Kempner LLP