Schneidwerkzeug
Anmelder: Sumitomo Electric Industries, Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4729217
- Anmeldetag
- 8. Mai 2024
- Veröffentlichung
- 13. November 2025
- Rechtsraum
- EP
- IPC
- B23B27/14
Abstract
A cutting tool includes: a substrate; and a coating film disposed on the substrate, wherein the coating film includes a first layer, the first layer is composed of α-Al<sub>2</sub>O<sub>3</sub>, a thickness of the first layer is 2 µm or more and 15 µm or less, in a cross section along a normal line of an interface between the substrate and the coating film, the first layer includes a plurality of grain boundaries each connecting an interface of the first layer close to the substrate and a surface of the first layer or an interface of the first layer close to a surface of the coating film, and a first grain boundary, which is at least one of the grain boundaries, has a plurality of straight line portions and three or more bending points each connecting two adjacent straight line portions of the straight line portions, in the first grain boundary, each of an intersection angle A1 at a bending point closest to the interface of the first layer close to the substrate and an intersection angle A2 at a bending point second closest to the interface of the first layer close to the substrate is 120° or more and less than 180°, in the first grain boundary, each of an intersection angle A4 at a bending point closest to the surface of the first layer or the interface of the first layer close to the surface of the coating film and an intersection angle A3 at a bending point second closest to the surface of the first layer or the interface of the first layer close to the surface of the coating film is 90° or more and 150° or less, in the first grain boundary, an average X1 of the intersection angle A1 and the intersection angle A2 and an average X2 of the intersection angle A3 and the intersection angle A4 satisfy a relation of a formula 1, and a ratio N2/N1 of the number N2 of the first grain boundaries to the number N1 of the grain boundaries is 0.2 or more.
Anmelder
- Firma
- Sumitomo Electric Industries, Ltd.
- Land
- 🇯🇵 Japan
Japanischer Technologiekonzern mit Sitz in Osaka, Teil der Sumitomo-Gruppe. Aktiv in Kabel- und Glasfasertechnologie, Halbleitern, Automobilkomponenten sowie Elektronik- und Werkstofftechnik.
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