Dreischichtiges Transmon-Qubit mit Fusionierten Elementen

Details

Veröffentlichungs-Nr.

EP4730214

Anmeldetag

15. Oktober 2024

Veröffentlichung

22. April 2026

Rechtsraum

EP

IPC

(BRINK MARKUS et al.)

Abstract

A quantum circuit and related manufacturing method are disclosed. The quantum circuit comprises a vertical Josephson junction (1001) formed by a bottom electrode (810) in a first superconducting material layer, a tunnel barrier (830), and a top electrode (820) in a second superconducting material layer. A contact portion (811) and a coupling portion (812) of the bottom electrode are located inside and outside the Josephson junction, respectively. A transmon qubit of the quantum circuit comprises the Josephson junction and a shunt capacitor formed by the top electrode and the contact portion of the bottom electrode as capacitor plates. A readout circuit is capacitively coupled to the bottom electrode through the coupling portion and includes a coupling head (861). The coupling portion is fitted into a recessed portion of the coupling head. The top electrode is configured as a floating electrode, not resistively coupled to the first superconducting material layer.

Anmelder

Firmen

Imec VZW
Katholieke Universiteit Leuven KU Leuven Research & Development

Land

🇧🇪 Belgien