Feder, Dämpfungsanordnung und Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4733609
- Anmeldetag
- 12. April 2024
- Veröffentlichung
- 13. März 2025
- Rechtsraum
- EP
- IPC
- F16C11/04, F16C11/12, H05K5/02
Abstract
A spring, a damping assembly, and an electronic device. The electronic device may include any one of a handheld device, an in-vehicle device, a wearable device, a terminal device or connected to a wireless modem, a cellular phone, a smartphone, a personal digital assistant, a computer, a tablet computer, a laptop, or the like. In embodiments of this application, a cross section of a spring wire is a rectangle. Under a same space condition, a coil spring with a rectangular cross section has a higher rigidity, absorbs more energy, and increases a damping force generated by the damping assembly, thereby improving a hand feeling of a user when folding or unfolding the electronic device. When a same damping force is met, the coil spring with a rectangular cross section occupies a smaller space, which facilitates arrangement of another component of the electronic device.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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