Leiterplatte

Details

Veröffentlichungs-Nr.

EP4734673

Anmeldetag

12. Juni 2024

Veröffentlichung

2. Januar 2025

Rechtsraum

EP

IPC

H05K3/38, H05K3/46

Abstract

A wiring board including: a conductor wiring; an insulating layer having a first principal surface to which a surface of the conductor wiring closely adheres, and a second principal surface on a side opposite to the first principal surface; a magnetic layer positioned on a side of the insulating layer where the second principal surface is present; and a conductor layer positioned on a side of the magnetic layer opposite to the insulating layer, wherein the surface or the first principal surface has an arithmetic mean roughness of 0.1 µm or greater and 5.0 µm or less.

Anmelder

Firma

Resonac Corporation

Land

🇯🇵 Japan