Packungsarchitektur für Photonische Integrierte Schaltungen

Details

Veröffentlichungs-Nr.

EP4737965

Anmeldetag

22. März 2022

Veröffentlichung

6. Mai 2026

Rechtsraum

EP

IPC

G02B6/30, G02B6/32, G02B6/42

Abstract

Photonic packages and device assemblies that include photonic integrated circuits (PICs) are described. An example integrated circuit (IC) device assembly comprises: a circuit board; a photonic package above the circuit board and a coupling structure between the circuit board and a second surface of a package support. The photonic package comprises: the package support having a first surface and the second surface opposite the first surface; a photonic integrated circuit (PIC) die over a first portion of the second surface of the package support; a processor die over a second portion of the second surface of the package support; a first electronic integrated circuit (EIC) die coupled in a flip-chip configuration with the PIC die; a second EIC die coupled in a flip-chip configuration with the PIC die; an optical coupler at a lateral surface of the PIC die; an adhesive between the optical coupler and the lateral surface of the PIC die; and a heat sink. Each of the PIC die and the processor die is between the package support and the heat sink.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA