Vorstrukturiertes Klebeband zur Ermöglichung einer Doppelseitigen Schaltungsanordnung

Details

Veröffentlichungs-Nr.

EP4738357

Anmeldetag

24. Oktober 2025

Veröffentlichung

6. Mai 2026

Rechtsraum

EP

Abstract

A method of producing a circuit die where the method includes applying a pre-patterned backing tape to a first surface of a semiconductor substrate that includes the first surface and a second surface, the second surface including one or more circuits; coating the second surface with an encapsulant; removing a patterned portion of the pre-patterned backing tape to expose one or more contact pads on the first surface; applying one of an electrically conductive adhesive (ECA) or solder to the one or more contact pads on the first surface; and coupling an electrical component to the contact pads using the ECA or solder.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA