Einzelätz- und Pfeilerzusammenführungsverfahren für Zell- und Kammmerkmale
Anmelder: MICRON TECHNOLOGY, INC. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4739026
- Anmeldetag
- 5. November 2025
- Veröffentlichung
- 6. Mai 2026
- Rechtsraum
- EP
- IPC
- H10B63/10, // H10N70/20
Abstract
Methods, systems, and devices for single etch and pier merge method for cell and comb features are described. One or more pillars and one or more piers for a memory array may be patterned, aligned, and formed in one processing step. For example, the one or more piers and the one or more pillars may be patterned and etched using a pillar shape to form a set of pillar cavities. A first subset of the pillar cavities may be etched such that pairs of adjacent pillar cavities merge to form a pier cavity that is filled with a first material and a liner to form the one or more piers. A second subset of the pillar cavities may be filled with the liner and the first material to form the one or more pillars. Comb edge structures may be formed based on a third subset of the pillar cavities.
Anmelder
- Firma
- MICRON TECHNOLOGY, INC.
- Land
- 🇺🇸 USA
US-amerikanisches Halbleiterunternehmen mit Sitz in Boise, Idaho. Micron entwickelt und fertigt Speicherchips wie DRAM und NAND-Flash sowie Speicherlösungen für Computer, Mobilgeräte, Rechenzentren und Automobile.
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