Mosfet mit Geteiltem Gate und Reduziertem On-Widerstand
Anmelder: STMicroelectronics International N.V. 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP4739030
- Anmeldetag
- 10. Oktober 2025
- Veröffentlichung
- 6. Mai 2026
- Rechtsraum
- EP
Abstract
Electronic device (10), comprising: a semiconductor body (12); trenches (13) within the semiconductor body (12) from a first side (12a) towards a second side (12b) of the semiconductor body (12) and terminating within the semiconductor body (12); an insulating field plate region (14) in each of said trenches (13); a conductive gate region (15) in each of said trenches (13) on the respective insulating field plate region (14), each being electrically insulated from the semiconductor body (12) by means of the respective insulating field plate region (14); a field plate region (16) in each of said trenches (13), buried in the respective insulating field plate region (14) and electrically insulated from the respective conductive gate region (15) and from the semiconductor body (12); gate interconnections (28) within the semiconductor body (12), from the first side (12a) towards the second side (12b), lateral to the trenches (13) and terminating in the semiconductor body (12), the gate interconnections (28) being of conductive material, insulated from the semiconductor body (12) and electrically connected to the conductive gate regions (15) in such a way as to electrically interconnect the conductive gate regions (15) with each other.
Anmelder
- Firma
- STMicroelectronics International N.V.
- Land
- 🇨🇭 Schweiz
Schweizer Gesellschaft des Halbleiterkonzerns STMicroelectronics, die Chips und Sensoren für Automobiltechnik, Industrie und Unterhaltungselektronik entwickelt.
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