Halbleiterstruktur
Anmelder: MEDIATEK INC. 🇹🇼
Details
- Veröffentlichungs-Nr.
- EP4739063
- Anmeldetag
- 7. Oktober 2025
- Veröffentlichung
- 6. Mai 2026
- Rechtsraum
- EP
Abstract
A semiconductor structure is provided. The semiconductor structure includes a substrate, electronic devices, and an interconnection structure. The electronic devices are disposed on the substrate. The electronic devices includes first gate structures. The interconnection structure including a first interconnection-level conductive trace is located directly above the electronic devices. The first interconnection-level conductive trace has first openings for exposing at least one of the first gate structures.
Anmelder
- Firma
- MEDIATEK INC.
- Land
- 🇹🇼 Taiwan
Taiwanisches Unternehmen, das Halbleiter und Chipsätze für Smartphones, Fernseher, WLAN-Geräte und andere elektronische Produkte entwickelt und vertreibt.
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