Verfahren zum Zusammenbau eines Eingebetteten Computersystems, das von einer Wiederverwendeten Hauptplatine Betrieben Wird

Details

Veröffentlichungs-Nr.

EP4741994

Anmeldetag

6. November 2024

Veröffentlichung

13. Mai 2026

Rechtsraum

EP

Abstract

This disclosure pertains to a method for repurposing a motherboard (100) to assemble an embedded computer system (1000, 2000, 3000, 4000), the method comprising the steps of:- (S1) extracting the motherboard (100) from an electronic device (10 ; 12, 14, 16);- (S2) directly connecting mechanically and electrically the extracted motherboard (100) to a carrier board (200), wherein the carrier board (200) provides electrical power and at least one motherboard interface to the extracted motherboard (100),- (S3) providing, via the carrier board (200), at least one standardized interface to the extracted motherboard (100), thereby enabling an external communication of the extracted motherboard (100), called repurposed motherboard (150), with electrical components external to the repurposed motherboard (150), and- (S4a, S4b, S4c) integrating the repurposed motherboard (150) into the embedded computer system (1000, 2000, 3000, 4000).

Anmelder

Firma

Swarn SRL

Land

🇧🇪 Belgien