Verfahren und System zur Befestigung einer Komponente auf einem Substrat
Anmelder: Aptiv Technologies AG 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP4742838
- Anmeldetag
- 11. November 2024
- Veröffentlichung
- 13. Mai 2026
- Rechtsraum
- EP
- IPC
- H05K1/02, H05K3/30
Abstract
The present disclosure relates to a method (100) for attaching one or more components (3), such as a camera or a sensor, onto a substrate (10), such as a printed circuit board, PCB, the method comprising: arranging (110) a component (3) onto an attachment portion (11) of a substrate (10), wherein the attachment portion (11) is at least partially provided with an adhesive (12); curing (120) the adhesive (12) by at least partially heating the attachment portion (11) and thereby at least partially attaching the component (3) to the substrate (10); wherein at least partially heating the attachment portion (11) comprises directly heating the attachment portion (11).
Anmelder
- Firma
- Aptiv Technologies AG
- Land
- 🇨🇭 Schweiz
Technologieunternehmen der Automobilzulieferindustrie mit Sitz in der Schweiz, das elektrische Architekturen, Sensorik, Software und vernetzte Systeme für Fahrzeuge entwickelt.
1.951 Patente in unserer Datenbank