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Standorte
5Aktuelle Patente
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05.08.2026 · Kokusai Electric Corporation
Verfahren zur Bestimmung der Rotationsgeschwindigkeit, Substratverarbeitungsverfahren, Verfahren zur Herstellung eines Halbleiterbauelements, Programm und Substratverarbeitungsvorrichtung
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Status
Angemeldet am 23.01.2026
Anhängig
Vertretung
Zusammenfassung
A technique of determining a rotational speed of a substrate (200), applied in a substrate processing including intermittently supplying, to the rotating substrate (200), a process gas from an outer edge of the substrate (200) toward an in-plane direction at a constant interval, a predetermined number of times K, during a predetermined duration T, includes: (a) calculating an evaluation value E corresponding to each of a plurality of candidate values N, which are candidate values for the selectable rotational speed of the substrate (200), based on: at least one selected from the group of the predetermined duration T and a supply interval I of the process gas; the predetermined number of times K; and each of the candidate values N; and (b) determining the rotational speed of the substrate (200) to be applied in the substrate processing from among the candidate values N based on the evaluation value E calculated for each candidate value N. |
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05.08.2026 · Kokusai Electric Corporation
Verfahren zur Substratverarbeitung, Verfahren zur Herstellung eines Halbleiterbauelements, Programm und Substratverarbeitungsvorrichtung
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Status
Angemeldet am 28.01.2026
Anhängig
Vertretung
Zusammenfassung
A technique includes (a) preparing a substrate (200) including a first film formed inside a recess, a surface of the first film inside the recess being terminated with a first termination that reduces wettability with respect to a processing liquid; and (b) removing at least a portion of the first film formed in a first region on an opening side of the recess while leaving the first film formed in a second region on a bottom side of the recess by supplying the processing liquid to the substrate (200) and selectively exposing, to the processing liquid, the surface of the first film formed in the first region with respect to the surface of the first film formed in the second region. |
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05.08.2026 · adidas AG
Stollen und Schuhartikel mit Stollen
Haushalts-, Möbel- & Konsumgüter
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Status
Angemeldet am 30.01.2026
Anhängig
Vertretung
Zusammenfassung
A cleat for an article of footwear is provided that inhibits clogging by debris. The cleat includes a base having a first side configured to face toward a ground surface and a second side opposite the first side. The first side has a domed surface with a convex curvature. The cleat further includes a plurality of arms extending radially from the first side of the base. Each of the arms has a first end coupled to the base and a second end extending away from the base. At least one arm has a first side configured to face toward the ground surface that includes a first surface extending from the first end to the second end. The first surface has no protrusions or ridges having a dimension greater than 0.5 mm. |
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05.08.2026 · Kokusai Electric Corporation
Verfahren zur Substratverarbeitung, Verfahren zur Herstellung eines Halbleiterbauelements, Substratverarbeitungsvorrichtung und Programm
Metallurgie & Oberflächentechnik
Halbleiter & Elektrische Bauelemente
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Status
Angemeldet am 16.12.2025
Anhängig
Vertretung
Zusammenfassung
There is provided a technique that includes (a) forming a layer containing a first element on a substrate by performing: (a1) supplying an inhibiting gas to the substrate to form an inhibiting group on the substrate, wherein the inhibiting group inhibits adsorption of a first gas containing an atom of the first element to the substrate; (a2) supplying a promoting gas to the substrate after start of (a1) to form a promoting group on the substrate, wherein the promoting group promotes adsorption of the first gas to the substrate; and (a3) supplying the first gas to the substrate after start of (a2). |
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05.08.2026 · SAMSUNG SDI CO., LTD.
Elektrode, Verfahren zur Herstellung davon und Wiederaufladbare Lithiumbatterie damit
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Status
Angemeldet am 27.01.2026
Anhängig
Vertretung
Zusammenfassung
The present disclosure relates to an electrode for a rechargeable lithium battery, a rechargeable lithium battery including the electrode, and a method for producing the electrode. The electrode includes an electrode current collector, a first active material layer on the electrode current collector, and a second active material layer on the first active material layer. The first active material layer includes a first active material and a first composite conductive material. The second active material layer includes a second active material and a second composite conductive material. The first composite conductive material includes a first carbon nanostructure and a first polymer, the first polymer being chemically bonded to a surface of the first carbon nanostructure. The second composite conductive material includes a second carbon nanostructure and a second polymer, the second polymer chemically bonded to a surface of the second carbon nanostructure. |
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29.07.2026 · SAMSUNG SDI CO., LTD.
Wiederaufladbare Batterie und Batteriepack mit der Wiederaufladbaren Batterie
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Status
Angemeldet am 17.12.2025
Anhängig
Vertretung
Zusammenfassung
A rechargeable battery may include an electrode assembly wound around a core portion and a current collector plate located on at least one side of the electrode assembly and electrically connected to the electrode assembly. The current collector plate may include a first region in line with the core portion and having a first thickness and a second region in line with an outer portion of the electrode assembly and having a second thickness that may be less than the first thickness. |
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29.07.2026 · Aptiv Connection Systems (Nan…
Verdrillter Paardatenverbinder
Halbleiter & Elektrische Bauelemente
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Status
Angemeldet am 26.01.2026
Anhängig
Vertretung
Zusammenfassung
This application discloses a twisted pair data connector, comprising: a front shell assembly, wherein the front shell assembly comprises a terminal channel defined therein; a rear cover assembly, the rear cover assembly is to be assembled with the front shell assembly to form an outer plastic shell structure, outer plastic shell structure has a cable channel defined therein, and the cable channel forms an angle with the terminal channel; wherein, a rear cover sealing body is provided at the joint between the front shell assembly and the rear cover assembly. |
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29.07.2026 · Aptiv Technologies AG
Kopfteil für Elektrische Verbinderanordnung und Zugehöriges Verfahren
Halbleiter & Elektrische Bauelemente
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Status
Angemeldet am 07.01.2026
Anhängig
Vertretung
Zusammenfassung
A header is configured for connection with a tray. The header includes a base, a tab, and a surface. The base defines an aperture extending through the base and configured to receive a connector. The tab extends from the base in a first direction and is configured to suppress translation of the header relative to the tray in a second direction transverse to the first direction. The surface extends from the base in the second direction and is configured to suppress rotation of the header relative to the tray. |
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29.07.2026 · Aptiv Technologies AG
Verfahren zur Montage einer Elektronischen Kamera
Optik & Fototechnik
Nachrichtentechnik & Telekommunikation
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Status
Angemeldet am 27.01.2025
Anhängig
Vertretung
Zusammenfassung
Method for assembly of an electronic camera 1, the method comprising the following steps: a. providing a camera housing 10, comprising a housing body 12, a hollow lens guidance 14 and a transparent top 16, wherein the transparent top t6 closes the lens guidance 14 at one end thereof; b. inserting a camera lens 20 into the lens guidance 14; c. inserting a printed circuit board 30, with a camera chip 40 mounted thereon, into the housing body 12, wherein the camera chip 40 is spaced apart from the camera lens 20; d. fixing the printed circuit board 30 within the housing body 12; e. inserting at least one adhesive applicator pin 50 through at least one opening i8 within the lens guidance 14 such that the adhesive applicator pin 50 contacts the camera lens 20; f. adjusting the distance D between the camera lens 20 and the camera chip 40 by moving the camera lens 20 by means of the adhesive applicator pin 50; and g. fixing the camera lens 20 within the lens guidance 14 by means of an adhesive 52 applied by the adhesive applicator pin 50. Further, an electronic camera 1 is claimed. |
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22.07.2026 · Fotona d.o.o.
Schaltung zum Pumpen eines Aktiven Mediums eines Lasers
Halbleiter & Elektrische Bauelemente
Elektronik & Schaltungstechnik
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Status
Angemeldet am 16.01.2025
Anhängig
Vertretung
Zusammenfassung
The present invention relates to a circuit for pumping an active medium of a laser, wherein the circuit is adapted to generate pumping voltage pulses by summing at least two mutually time-shifted voltage pulses, and to apply the pumping voltage pulses to a pump for pumping the active medium of the laser. The present invention also relates to a laser comprising such circuit. |
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Vertretene Patentanmelder
Die Patentanmelder, die Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte in den erfassten Patenten am häufigsten vertritt.
| Anmelder | Anzahl Patente |
|---|---|
| 1. Qualcomm | 7.141 |
| 2. Adidas | 356 |
| 3. Dell Products | 306 |
| 4. Aptiv | 278 |
| 5. Nintendo | 119 |
| 6. Kokusai Electric | 93 |
| 7. JT International | 89 |
| 8. SnapTrack | 36 |
| 9. Wago Verwaltungsgesellschaft | 31 |
| 10. Samsung SDI | 25 |
| 11. Carl Zeiss SMT | 24 |
| 12. Bridgestone Europe | 18 |
| 13. Melexis Technologies | 16 |
| 14. Northrop Grumman | 16 |
| 15. Pierburg GmbH | 15 |
Patente nach Jahr
Nach Anmeldejahr. Patentanmeldungen werden in der Regel erst 18 Monate nach der Anmeldung veröffentlicht, daher sind die jüngsten Jahre noch unvollständig. Der graue Balkenanteil zeigt eine Hochrechnung auf Basis der typischen Veröffentlichungsverzögerung: so viele Anmeldungen sind für das Jahr insgesamt zu erwarten.