Elektronische Leiterplatte mit Plattiertem Durchgangsloch und Axialen und Radialen Ringförmigen Vorsprüngen

Details

Veröffentlichungs-Nr.

EP4742840

Anmeldetag

11. November 2024

Veröffentlichung

13. Mai 2026

Rechtsraum

EP

IPC

H05K1/11, H05K3/00, H05K3/42

Abstract

An electronic board (100) which comprises a stack (102) comprising at least one electrically insulating layer structure (104) and a plurality of electrically conductive layer structures (106, 108), wherein one of said plurality of electrically conductive layer structures (106) is provided on one main surface (110) of said at least one electrically insulating layer structure (104) and a further one of said plurality of electrically conductive layer structures (108) is provided on an opposing further main surface (112) of said at least one electrically insulating layer structure (104), a through hole (120) formed in the stack (102) and being laterally delimited by conductive material, at least one plating layer (122) provided on at least part of both opposing main surfaces (114, 116) of the stack (102) and on a lateral wall (118) of the stack (102), an axial annular protrusion (126, 128) provided at one extremity of the through hole (120), and a radial annular protrusion (130, 132, 134) provided at the lateral wall (118) of the stack (102).

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich

Fachgebiete