Die-Verformung unter Verwendung von Phasenwechselmaterialien
Anmelder: ASML Netherlands B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4745667
- Anmeldetag
- 18. November 2024
- Veröffentlichung
- 20. Mai 2026
- Rechtsraum
- EP
- IPC
- G03F7/00, H01L21/18(ZINNER DOMINIK et al.)(RYU HYUNGJU et al.)(CANON KK et al.)
Abstract
Disclosed is a method of deforming a first patterned substrate or one or more first substrate portions thereof, configured to be bonded to a second patterned substrate, the method comprising providing at least said first patterned substrate or one or more first substrate portions thereof with a layer comprising a material that changes its phase when exposed to a radiation; and irradiating the layer with the radiation, wherein the radiation imposes a stress within the first patterned substrate or one or more first substrate portions thereof, the stress causing deformation of the first patterned substrate or one or more first substrate portions thereof that at least partially corrects a position error of a pattern of the first patterned substrate or one or more first substrate portions thereof.
Anmelder
- Firma
- ASML Netherlands B.V.
- Land
- 🇳🇱 Niederlande
Niederländisches Unternehmen, das Lithografiesysteme und weitere Anlagen für die Halbleiterfertigung entwickelt und herstellt, zentral für die Chipindustrie.
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ASML Netherlands B.V.