Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4749841
- Anmeldetag
- 22. Januar 2025
- Veröffentlichung
- 31. Juli 2025
- Rechtsraum
- EP
- IPC
- H01R13/648, H05K1/02
Abstract
Embodiments of this application provide an electronic device. The electronic device includes a charging interface, a first circuit board, a metal reinforcement member and a bracket assembly. The first circuit board includes a connection end. The connection end has a ground terminal. The connection end is electrically connected to the charging interface. The metal reinforcement member and the connection end are stacked. The metal reinforcement member is electrically connected to the ground terminal. The bracket assembly includes a metal bracket and a conductive member. At least part of the connection end is located in the metal bracket. The metal bracket includes a body portion and a ground portion. The ground portion is electrically connected to the body portion. The metal reinforcement member and the body portion are respectively electrically connected to the conductive member. The ground portion is configured to be grounded. The electronic device in the embodiments of this application helps reduce structural design difficulty, and reduce assembly difficulty and production costs.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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