Datenübertragungsverfahren, Chip und Speichermedium

EP4750002 6. März 2025

Anmelder: Shenzhen Goodix Technology Co., Ltd. 🇨🇳

Details

Veröffentlichungs-Nr.
EP4750002
Anmeldetag
9. Februar 2024
Veröffentlichung
6. März 2025
Rechtsraum
EP
IPC
H04L12/40
Offizieller Volltext

Abstract

Embodiments of the present disclosure relate to the technical field of electronic communication, and provide a method for data transmission, a chip, and a storage medium, wherein the method for data transmission is applied to a target node and comprises: obtaining a first data packet transmitted via a physical layer; and sending, based on a physical transmission medium used to connect a first interface of the target node to a second interface of a downstream node, the first data packet to a physical layer of the downstream node through a physical layer of the target node. With this solution, the first data packet is transmitted in the physical layer, to-be-transmitted data accounts for a large proportion in the first data packet, thereby improving the bandwidth utilization of the target node for data transmission. Moreover, the first data packet is directly transmitted to the downstream node through the physical layer of the target node, without the need for transmission through a switch and without the need for complex encapsulation through a MCU of the target node, thereby reducing the transmission latency in data transmission by the target node, and improving the transmission efficiency.

Anmelder

Firma
Shenzhen Goodix Technology Co., Ltd.
Land
🇨🇳 China
🇨🇳 Goodix Technology

Chinesischer Halbleiterhersteller mit Sitz in Shenzhen, spezialisiert auf Fingerabdrucksensoren, Touch-Controller und Sicherheitschips für mobile Endgeräte.

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