Leiterplattenanordnung, Heizsteuerschaltung und Steuerverfahren dafür

Details

Veröffentlichungs-Nr.

EP4750227

Anmeldetag

1. August 2025

Veröffentlichung

27. Mai 2026

Rechtsraum

EP

Abstract

A printed circuit board assembly includes a circuit board, a heater resistor and a switch. The circuit board includes a component layer, a signal layer, a conductive layer and a conductive via. The component layer includes a mounting area for mounting a component. The signal layer includes first and second traces. The conductive layer is disposed between the component layer and the signal layer. The component layer includes a conductive pattern. The conductive via connects the first trace to the conductive pattern. The heater resistor includes a first terminal electrically connected to the first trace and a second terminal electrically connected to the second trace. The conductive pattern, the conductive via, the first trace, the heater resistor, the switch and the second trace are electrically connected in series between a power supply voltage terminal and a ground terminal.

Anmelder

Firma

Getac Technology Corporation

Land

🇹🇼 Taiwan