Flexible Leiterplatte und Elektronische Vorrichtung

EP4750231 8. Mai 2025

Anmelder: Honor Device Co., Ltd. 🇨🇳

Details

Veröffentlichungs-Nr.
EP4750231
Anmeldetag
9. August 2024
Veröffentlichung
8. Mai 2025
Rechtsraum
EP
IPC
H05K1/18, H04M1/02
Offizieller Volltext

Abstract

This application relates to the field of electronic product technologies, and in particular, to a flexible printed circuit and an electronic device. The flexible printed circuit is configured to connect to a USB interface and a mainboard in the electronic device. The flexible printed circuit includes two flexible circuit boards, that is, a first flexible circuit board and a second flexible circuit board, which are detachably connected. The first flexible circuit board is arranged on a rear side of a battery and is connected to the USB interface. The second flexible circuit board is arranged on a front side of the battery and is connected to the mainboard. When the USB interface needs to be detached, the first flexible circuit board can be seen by opening a cover plate on a rear side of the electronic device. Because the first flexible circuit board is detachably connected to the second flexible circuit board, the connection between the first flexible circuit board and the second flexible circuit board may be conveniently released, so that the first flexible circuit board is removed, and then subsequent processing is performed on the USB interface. In this way, there is no need to detach the battery, and steps of detaching the USB interface are simplified, so that the detaching complexity is reduced and there is no need to reinstall the battery, thereby reducing assembly difficulty and repair costs.

Anmelder

Firma
Honor Device Co., Ltd.
Land
🇨🇳 China
🇨🇳 Honor

Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.

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