Wärmeableitungsvorrichtung für Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4750235

Anmeldetag

24. Juni 2024

Veröffentlichung

23. Januar 2025

Rechtsraum

EP

IPC

H05K7/20

Abstract

The present invention relates to a heat dissipation apparatus for an electronic device, the heat dissipation apparatus comprising: a heat dissipation housing having an inner space and open at the front; various types of heating elements that are arranged in a plurality of regions in the up-down direction on an inner surface corresponding to the inner space of the heat dissipation housing; and a plurality of heat sink fins that are arranged lengthwise in the up-down vertical direction on the back surface of the heat dissipation housing and detachably coupled so as to be spaced at certain intervals in the left-right horizontal direction. The plurality of heat sink fins are arranged so as to be discontinuous in the up-down direction near the boundaries of the plurality of regions, and thus provide the advantage of significantly improving heat dissipation performance.

Anmelder

Firma

KMW Inc.

Land

🇰🇷 Südkorea

Fachgebiete