Metall-Gate-Schnitte mit Hohem Aspektverhältnis
Anmelder: Intel Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4750252
- Anmeldetag
- 25. August 2023
- Veröffentlichung
- 27. Mai 2026
- Rechtsraum
- EP
Abstract
An integrated circuit structure, comprises a first plurality of nanoribbons (104) above a first sub-fin region (108); a second plurality of nanoribbons (104) above a second sub-fin region (108), the second plurality of nanoribbons laterally spaced apart from the first plurality of nanoribbons; a dielectric fill (106) adjacent to the first sub-fin region and the second sub-fin region; a first gate layer (118a) around the first plurality of nanoribbons; a second gate layer (118b) around the second plurality of nanoribbons; and a gate cut (120) laterally between the first plurality of nanoribbons and the second plurality of nanoribbons and extending into the dielectric fill between the first sub-fin region and the second sub-fin region, the gate cut in contact with the first gate layer and the second gate layer, wherein the gate cut has a bottom surface above a bottom surface of the dielectric fill, wherein the gate cut has a height-to-width aspect ratio of 5:1 or greater.
Anmelder
- Firma
- Intel Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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