Klebeband und Klebstoffzusammensetzung
Anmelder: Sekisui Chemical Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4752184
- Anmeldetag
- 19. Juli 2024
- Veröffentlichung
- 30. Januar 2025
- Rechtsraum
- EP
Abstract
The present invention aims to provide an adhesive tape having excellent adhesion under high-temperature conditions. The present invention also aims to provide an adhesive composition having excellent adhesion under high-temperature conditions. Provided is an adhesive tape including an adhesive layer, the adhesive layer containing an acrylic copolymer, the adhesive layer having a shear storage modulus at 150°C of 8.0 × 10<4> Pa or greater and 3.0 × 10<5> Pa or less as measured by dynamic viscoelasticity measurement at a measurement frequency of 1 Hz and having a loss tangent (tanδ) at 150°C of 0.10 or greater and 0.40 or less as measured by dynamic viscoelasticity measurement at a measurement frequency of 1 Hz.
Anmelder
- Firma
- Sekisui Chemical Co., Ltd.
- Land
- 🇯🇵 Japan
Japanischer Chemiekonzern mit Sitz in Osaka, tätig in den Bereichen Hochleistungskunststoffe, Bauelemente und elektronische Materialien.
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