Steuerungsverfahren zur Verbesserung der Co-Planarität von Mikrobumps über einem Wafer oder Chip

Details

Veröffentlichungs-Nr.

EP4752633

Anmeldetag

2. April 2026

Veröffentlichung

3. Juni 2026

Rechtsraum

EP

IPC

G03F7/00, G03F9/00, H10W90/00

Abstract

An exposure apparatus arranged for preparing a current wafer for creation of microbumps in a subsequent volume-additive process, wherein the exposure apparatus comprises a wafer table arranged for holding the current wafer having a photoresist layer provided on top of the wafer, a patterning device arranged for exposing the photoresist according to a pattern such that, after a further processing step of the photoresist layer, a plurality of openings in the photoresist layer, thereby exposing corresponding sections of the current wafer through the plurality of openings and a controller arranged for receiving dimension data of a plurality of microbumps created in a volume-additive process for a previous wafer and adjusting one or more exposure parameters of the patterning device based on the dimension data.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande